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| 3.2x2.4mm SMD CHIP LED LAMP APD3224MBC BLUE Features !3.2x2.4mm SMT LED, 2.4mm THICKNESS. !LOW POWER CONSUMPTION. !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE Description The Blue source color devices are made with GaN on SiC Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. : 1500PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAB0008 APPROVED : J. Lu REV NO: V.3 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN:D.L.HUANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e L en s Ty p e Iv (m c d ) @ 20 m A Min . APD3224MBC BLUE (GaN) WATER CLEAR 36 Ty p . 80 V i ew i n g An g l e 21/2 20 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Absolute Maximum Ratings at T)=25C Sy m b o l peak D 1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current Blue Blue Blue Blue Blue Blue D ev i c e Ty p . 430 466 60 100 3.8 4.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s I F =20mA I F =20mA I F =20mA V F =0V;f =1MHz I F =20mA V R = 5V Absolute Maximum Ratings at T)=25C P ar am e t e r Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating / Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. B lu e 105 30 150 5 -40C To +85C Un it s mW mA mA V SPEC NO: DSAB0008 APPROVED : J. Lu REV NO: V.3 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN:D.L.HUANG PAGE: 2 OF 4 Blue APD3224MBC SPEC NO: DSAB0008 APPROVED : J. Lu REV NO: V.3 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN:D.L.HUANG PAGE: 3 OF 4 APD3224MBC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAB0008 APPROVED : J. Lu REV NO: V.3 CHECKED :Allen Liu DATE:MAR/22/2003 DRAWN:D.L.HUANG PAGE: 4 OF 4 |
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